Processor | |
Processor cores | 6 |
Processor cache | 12 MB |
Processor manufacturer | Intel |
Thermal Design Power (TDP) | 65 W |
Processor lithography | 14 nm |
Processor codename | Comet Lake |
Processor cache type | Smart Cache |
Processor family | 10th gen Intel® Core™ i5 |
Memory bandwidth supported by processor (max) | 41.6 GB/s |
Box | N |
Processor socket | LGA 1200 (Socket H5) |
Processor ARK ID | 199278 |
Cooler included | Y |
Generation | 10th Generation |
Processor base frequency | 2.9 GHz |
Processor model | i5-10400F |
System bus rate | 8 GT/s |
Processor threads | 12 |
Processor operating modes | 64-bit |
Processor boost frequency | 4.3 GHz |
Component for | PC |
Technical details | |
Vendor | Intel |
Product type | Processor |
Status | Launched |
Launch date | Q2’20 |
Maximum memory | 128 GB |
Bus speed | 8 GT/s |
Supported memory types | DDR4-SDRAM |
Weight & dimensions | |
Processor package size | 37.5mm x 37.5mm mm |
Other features | |
Maximum internal memory | 128 GB |
Graphics | |
Discrete graphics card | N |
On-board graphics card model | Not available |
Discrete graphics card model | Not available |
On-board graphics card | N |
Processor special features | |
Intel® AES New Instructions (Intel® AES-NI) | Y |
Enhanced Intel SpeedStep Technology | Y |
Intel Trusted Execution Technology | N |
Intel VT-x with Extended Page Tables (EPT) | Y |
Intel® Secure Key | Y |
Intel 64 | Y |
Intel Stable Image Platform Program (SIPP) | N |
Intel® OS Guard | Y |
Intel Virtualization Technology for Directed I (O (VT-d)) | Y |
Intel Software Guard Extensions (Intel SGX) | Y |
Intel Virtualization Technology (VT-x) | Y |
Intel Turbo Boost Max Technology 3.0 | N |
Intel® Optane™ Memory Ready | Y |
Intel® Boot Guard | Y |
Intel® Thermal Velocity Boost | N |
Intel® vPro™ Platform Eligibility | N |
Intel® Transactional Synchronization Extensions | N |
Intel® Turbo Boost Technology 2.0 frequency | 4.3 GHz |
Intel® Identity Protection Technology (Intel® IPT) | Y |
Intel® Hyper Threading Technology (Intel® HT Technology) | Y |
Intel® Turbo Boost Technology | 2.0 |
Features | |
Execute Disable Bit | Y |
Idle States | Y |
Thermal Monitoring Technologies | Y |
Scalability | 1S |
CPU configuration (max) | 1 |
Embedded options available | N |
PCI Express configurations | 1×16,2×8,1×8+2×4 |
Thermal solution specification | PCG 2015C |
Maximum number of PCI Express lanes | 16 |
Harmonized System (HS) code | 8542310001 |
Supported instruction sets | SSE4.1,SSE4.2,AVX 2.0 |
Export Control Classification Number (ECCN) | 5A992C |
Commodity Classification Automated Tracking System (CCATS) | G077159 |
PCI Express CEM revision | 3.0 |
PCI Express slots version | 3.0 |
Operational conditions | |
Tjunction | 100 °C |
Memory | |
ECC | N |
Maximum internal memory supported by processor | 128 GB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2666 MHz |
Memory channels | Dual-channel |
Packaging data | |
Package type | Retail box |
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