Processor | |
Processor cores | 16 |
Processor frequency | 3.2 GHz |
Processor cache | 22 MB |
Processor lithography | 14 nm |
Processor codename | Cascade Lake |
Processor family | Intel Xeon W |
Box | N |
Processor socket | LGA 3647 |
Processor ARK ID | 193753 |
Cooler included | N |
Intel Volume Management Device (VMD) | Y |
Processor model | W-3245 |
Processor threads | 32 |
Processor boost frequency | 4.4 GHz |
Component for | Server/Workstation |
Technical details | |
Vendor | Intel |
Product type | Processor |
Status | Launched |
Launch date | Q2’19 |
Memory speed (max) | 2933 MHz |
Weight & dimensions | |
Processor package size | 76.0 x 56.5 mm |
Graphics | |
Discrete graphics card | N |
On-board graphics card model | Not available |
Discrete graphics card model | Not available |
On-board graphics card | N |
Processor special features | |
Intel® AES New Instructions (Intel® AES-NI) | Y |
Enhanced Intel SpeedStep Technology | Y |
Intel Trusted Execution Technology | Y |
Intel VT-x with Extended Page Tables (EPT) | Y |
Intel TSX-NI | Y |
Intel 64 | Y |
Intel Virtualization Technology for Directed I (O (VT-d)) | Y |
Intel Virtualization Technology (VT-x) | Y |
Intel Turbo Boost Max Technology 3.0 | Y |
Intel® Speed Shift Technology | Y |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Intel® Boot Guard | Y |
Intel® Deep Learning Boost | Y |
Intel® Optane™ DC Persistent Memory technology | N |
Intel® Resource Director Technology (Intel® RDT) | N |
Intel® Run Sure Technology | Y |
Intel® Speed Select Technology – Base Frequency (Intel® SST-BF) | N |
Intel Speed Select Technology (SST) | N |
Intel® vPro™ Platform Eligibility | Y |
Mode-based Execute Control (MBE) | Y |
Intel® Deep Learning Boost (Intel® DL Boost) | Y |
Intel® Speed Select technology – Performance Profile (Intel® SST-PP) | N |
Intel® Speed Select technology – Base Frequency | N |
Intel® Volume Management Device (VMD) | Y |
Intel® Optane™ DC Persistent Memory Supported | N |
Intel® vPro™ Technology | Y |
Intel® Hyper Threading Technology (Intel® HT Technology) | Y |
Intel® Turbo Boost Technology | 2.0 |
Features | |
Execute Disable Bit | Y |
Scalability | 1S |
Embedded options available | N |
Maximum number of PCI Express lanes | 64 |
Harmonized System (HS) code | 8542310001 |
Supported instruction sets | AVX-512 |
PCI Express CEM revision | 3.0 |
PCI Express slots version | 3.0 |
Power | |
Thermal Design Power (TDP) | 205 W |
Operational conditions | |
Tcase | 77 °C |
Memory | |
ECC | Y |
Maximum internal memory supported by processor | 1024 GB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2933 MHz |
Memory channels | Hexa |
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